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Using research of potassium peroxymonosulfate in the different etching environments

초록 :이 논문은 두 가지 마이크로 에칭 시스템, PPS (Potassium Monopersulfate) / 인산 / 안정제 및 Monopersulfate / Sulfuric Acid System을 소개했습니다. 에칭 과정에서 온도, 농도, 구리 함량과 같은 영향 요인을 연구합니다. 결과는 PPS / 인산 / 안정제 시스템이 PCB 산업에서 마이크로 에칭 요구를 충족시키기 위해보다 제어 가능하고 안정적이라는 것을 나타냈다.

키워드 : potassium Monopersulfates, 인산, 황산, 안정제

As PCBs move toward multi-layer and high-density interconnects, the requirements for PCB chemical microetchers are increasing, while the instability and use of microetchers like peroxymonosulfate/sulfuric acid, hydrogen peroxide/sulfuric acid systems Convenient , will not be able to meet the requirements. The micro-etching system with potassium monopersulfate complex KMPS as the main component has increasingly shown its advantages: (1) uniform, controllable etching rate, easy to use; (2) the surface to be treated is more uniform, and can be based on Need to regulate the desired effect; (3) high solubility, fast dissolution, easy to dissolve; (4) easy to clean the system after etching, minimal residue; (5) chemical stability, easy storage. The printed wiring board microetching agent of the present invention comprises a PPS, a stabilizer, and a phosphoric acid system. Applicable to the pre-treatment of PCB process, the micro-etching rate is more stable, the amount of copper dissolved is much higher than that of the conventional micro-etching system; and the same surface adhesion after micro-etching, the amount of copper used in the micro-etching system of the present invention is less. In addition, the present invention can also reduce the Giovanni effect generated in a general micro-etching system, so that the micro-etching effect is more outstanding.

1   Experimental materials and methods

1.1   Experimental Materials   Single potassium monoperpersulfate ( Hebei Natai Chemical Industry Co., Ltd. ), phosphoric acid, sulfuric acid, copper plate (double panel).

1.2   experimental method   The experiment used the weight loss method to measure the micro-etching rate.

(1) Take a standard sample for each experiment (4 cm×4 cm), cleaned, use filter paper to dry the surface moisture;

(2) take the sample at 110   Dry at °C for about 20   Min;

(3) Weighing after natural cooling, recorded as W1 (unit: g, accurate to four decimal places);

(4) Simulated micro- etching experiment in a beaker , time 1   Min;

(5) After the sample is taken out, it is quickly cleaned, and the surface water is absorbed by the filter paper;

(6) Dry under the same conditions as 2, weighed after natural cooling, and recorded as W2;

(7) Calculation formula:   Bite weight (μ Inch)=(W1-W2)/2.48×6810.7/2   In the formula:   V——etching speed, mm/min;   W1-W2——the quality of the copper foil being etched away, g;

2   Experimental results and discussion

Comparison of etch rates .   The PPS content was fixed, and the change of the etching rate of PPS/phosphoric acid/stabilizer system and PPS/sulfuric acid system at different temperatures was compared. Figure 1 shows the effect of temperature on the two systems. As can be seen from the left figure , when the temperature reaches 37 under the PPS/phosphoric acid/ stabilizer system   After °C, the etch rate changes evenly, and the magnitude of the change is small, 43   The change of the etching rate tends to be gentle after °C; while the etching rate increases with the increase of temperature in the PPS/sulfuric acid system on the right, the etching amplitude changes greatly under the same etching amount. This shows that the etching process of PPS/phosphoric acid/stabilizer system is more uniform and mild, and the presence of stabilizer can control the etching amount within a certain range when the concentration of potassium monopersulfate is too high or too low, and the controllability is good.Contact mail: hk8866@hotmail.com/ whatsapp +8618332108399

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